Deep Learning For Failure Analysis & Process Engineering

Harness the Power of Computer Vision to Streamline Failure Analysis

Discover the power of uncovering minuscule imperfections in the nano world, all at lightning speed.
Even the tiniest flaws in the micro world can unleash significant complications in the larger realm of technology.

As nanotechnology, material science, and semiconductor manufacturing technologies continue to evolve, everything gets smaller. However, the nanotechnology also amplifies the impact of minor defects on semiconductors, materials, and MEMS.

Fortunately, Deep Block's cutting-edge machine vision technology, integrated with its ultra-high-resolution microscope image analysis, emerges as the ultimate solution to conquer these intricate challenges and eliminate imperfections.

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Why are high-resolution images difficult to analyze?

Discover the countless challenges posed by large-volume, high-resolution images.

Discover the incredible challenges presented by large-volume, high-resolution images. These images are truly massive in terms of their size. Simply rendering high-resolution images on the front-end is a complex task, and combining such enormous images with machine vision technology poses an even greater challenge.

Due to their size and resolution, these images need to be divided and analyzed. However, this process brings a lot of problems, including speed problem and the potential loss of features when analyzing the countless pieces of the image.

Fortunately, by harnessing the power of Deep Block's computer vision technology specifically designed for ultra-high resolution images, your microscopic image analysis can be effortlessly automated, making it incredibly easy.

What We Do

Failure Analysis & Layer Morphology Analysis

While the thin film remains unseen to our unaided vision, it reveals itself as a THICK layer when magnified by an electron microscope.

We are very interested in the step coverage, morphology, and composition of each layer, but we rely on our eyes to see the thickness and connectivity of the numerous gates and metals that exist in the HUGE WAFER OCEAN.

Take control of your Micrograph analysis today without any coding knowledge. Create your own machine learning model and harness the power of our state-of-the-art machine vision technology. Trust Deep Block to gain insight into thin film morphology.

Connectivity of Metal

Assess metal connectivity with precision. As vias diminish in size and the necessity to packaging the chip arises, it becomes crucial to consistently guarantee the process examination of both deposition and etching processes after every adjustment.

Leveraging TEM for comprehensive, destructive analysis or employing SEM for detailed surface exploration, our cutting-edge computer vision technology is at your disposal to elevate the evaluation of the expansive surface.

Through Silicon Via

Connecting chips requires precision drilling of tiny holes, a task so delicate that a single misstep makes the chips unusable.

As the complexity of this task mounts, we're faced with the challenge of creating thousands of these minuscule connections.

The nature of attaching one chip to another becomes a painful journey. And when things don't go as planned, the sting of criticism from our supervisor is followed by long nights hunched over a microscope, engaged in failure analysis to pinpoint the exact cause of the error.

Fear not, for Deep Block stands by your side, ready to alleviate the strain of this intricate process!

Process Engineering

Ensure the precise deposition of each layer and examine the your process.

Even the smallest variation in thickness or an unforeseen etching mishap can undermine the chip manufacturing process, resulting in its failure.

With the advent of cutting-edge design like GAA, demanding the use of destructive examination to inspect them.

Embrace the power of machine learning to automatically evaluate the thickness and configuration, enhancing your quality control measures.

Why TEM?

The demand for Transmission Electron Microscopy (TEM) is significantly boosted by the NXE systems, packaging technologies, and High Bandwidth Memory (HBM).

As vias and layers shrink in size, the details we need to observe become increasingly minuscule.

The limitations of in-situ imaging become apparent, necessitating destructive testing and the indispensable use of Transmission Electron Microscopy (TEM).

For example, SK Hynix is at the forefront with a specialized TEM team.

Your company also have own experts who prepare chip samples for TEM analysis on a daily basis.

Looking ahead, the quest to explore even finer structures means TEM will become more crucial than ever.

We are tasked with the intricate challenge of discerning the smallest of structures, interpreting very thin films as mere lines, dots, or substantial layers.